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FF Danus30 P

Besides the unique Hi-platform, multi-beam and BTM transducer technology, the Danus’ compact, well-balanced design, high portability and built-in battery make it a smart choice for clinicians for their daily use.

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Connection method
Due to the uniform bonding process, the bonding of ceramic and lead is well controlled (maximum thickness: 1 µm) to improve the uniformity of characteristics between elements.

Triple layer matching
Better sensitivity and throughput can be achieved by triple matching.

Cutting of trace elements
By cutting the trace elements, one element is cut into several sub-elements to increase the sensitivity and throughput of the sensor.


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